Advanced Packaging Made Easy | Valdamark Packaging 

In order to make chip packaging flexible packaging manufacturers are having to develop advanced packaging solutions to deal with the challenges in the coming years.

Sourced through Scoop.it from: semiengineering.com

One of the most essential elements in Semiconductor design is packaging. It is no secret though this is one of the most hard to master parts both technically & economically!

 

 

Since chips were developed packaging was from the start just simply a way to protect the device. It still does today but as technology advances and components become more sophisticated packaging has to step up and take on a much broader role. 

 

This role needs to be strategic in that flexible packaging manufacturers must consider how new packaging is application specific and often forms a vital part of the system architecture. 

 

Its common to product packaging able to channel heat, improve performance and reduce power and costs. With electronics packaging signal strength of components can even be improved by the packaging. 

 

This advanced packaging is completely different from the typical plastic and ceramic solutions we commonly see. These types of materials are developed to enhance the reliability of semiconductor & node products as well being able to overcome the thermal and electrostatic limitations of legacy packaging films

 

The best example of this is in multi chip packaging. Here a third dimension enables processors to access memories using extremely fast connections. This significantly improves on sending signals end to end across a large chip using just thin wires. With this method heat will often build up and create resistance.

 

Advanced Packaging has been gaining momentum in recent years, particularly with server chips & mobile phones however there is just not the commonality among solutions for it to be considered anything like mainstream. 

 

The main reason for this are – 

 

  • The vast majority of companies experimenting with advanced packaging have pushed the performance boundaries. However reductions in power to cost benefits have presented challenges. E.g. Moors Law.
  • Most of the earlier implementations were bespoke designs that used non standard approaches and materials like MIL PRF 131 K and Def Stan 81-147 (formerly DEF STAN 81-75)standards. Whist most advanced packaging products were developed for known application like mobiles phones and network chips, most have been developed for very specific projects and use cases. 
  • The mainstream chip makers or rather those not at the cutting edge of chip & node research still have much room for maneuver with regards to the power and performance ratios for established chips. This is made even more of a benefit due to the fact that most manufacturers are adding optional extras to existing designs very quickly. 

 

A consensus around advanced packaging is starting to be reached, however the industry remains in flux and with constant changes forecast over the coming years it is incumbent upon flexible packaging manufacturers to experiment and develop new solutions to meet the challenges. 

 

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